Synthesis and characterization of tin and nickel-tungsten thin films for transient liquid phase bonding

• Main Author: Cheng, Xin Wei
• Other Authors: Chen Zhong
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2021
• Subjects: Engineering::Materials::Electronic packaging materials
• Online Access: https://hdl.handle.net/10356/147743
• Institution: Nanyang Technological University

In order to address the issue for the usage of electronic systems in harsh conditions such as high temperature applications, this project focuses on the reliability and resilience of the electronic packaging interconnect solder joints. A new soldering method called the Transient Liquid Phase (TLP) b...