Synthesis and characterization of tin and nickel-tungsten thin films for transient liquid phase bonding

• المؤلف الرئيسي: Cheng, Xin Wei
• مؤلفون آخرون: Chen Zhong
• التنسيق: Final Year Project
• اللغة: English
• منشور في: Nanyang Technological University 2021
• الموضوعات: Engineering::Materials::Electronic packaging materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/147743
• المؤسسة: Nanyang Technological University

In order to address the issue for the usage of electronic systems in harsh conditions such as high temperature applications, this project focuses on the reliability and resilience of the electronic packaging interconnect solder joints. A new soldering method called the Transient Liquid Phase (TLP) b...