Synthesis and characterization of tin and nickel-tungsten thin films for transient liquid phase bonding
In order to address the issue for the usage of electronic systems in harsh conditions such as high temperature applications, this project focuses on the reliability and resilience of the electronic packaging interconnect solder joints. A new soldering method called the Transient Liquid Phase (TLP) b...
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| 主要作者: | |
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| 其他作者: | |
| 格式: | Final Year Project |
| 語言: | English |
| 出版: |
Nanyang Technological University
2021
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| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/147743 |
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