Design and characterization of metal coatings on high temperature polymers for harsh environment electronics board
Commercially, polymers such as polyimide, epoxy and FR-4 are the most commonly used electronic packaging material. However, for high temperature applications such as in the aerospace and marine industries, these polymers are reaching their mechanical and thermal limits. Intensive research has been c...
Saved in:
| 主要作者: | |
|---|---|
| 其他作者: | |
| 格式: | Final Year Project |
| 語言: | English |
| 出版: |
Nanyang Technological University
2021
|
| 主題: | |
| 在線閱讀: | https://hdl.handle.net/10356/147763 |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|