Design and characterization of metal coatings on high temperature polymers for harsh environment electronics board

Commercially, polymers such as polyimide, epoxy and FR-4 are the most commonly used electronic packaging material. However, for high temperature applications such as in the aerospace and marine industries, these polymers are reaching their mechanical and thermal limits. Intensive research has been c...

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Bibliographic Details
Main Author: Ong, Si Hui
Other Authors: Gan Chee Lip
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2021
Subjects:
Online Access:https://hdl.handle.net/10356/147763
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Institution: Nanyang Technological University
Language: English