Design and characterization of metal coatings on high temperature polymers for harsh environment electronics board

• Main Author: Ong, Si Hui
• Other Authors: Gan Chee Lip
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2021
• Subjects: Engineering::Materials
• Online Access: https://hdl.handle.net/10356/147763
• Institution: Nanyang Technological University

Commercially, polymers such as polyimide, epoxy and FR-4 are the most commonly used electronic packaging material. However, for high temperature applications such as in the aerospace and marine industries, these polymers are reaching their mechanical and thermal limits. Intensive research has been c...