Understanding fillers for electronic packaging

• Main Author: Lim, Daniel Kang Xin
• Other Authors: Hortense Le Ferrand
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2021
• Subjects: Engineering::Materials::Composite materials
• Online Access: https://hdl.handle.net/10356/147776
• Institution: Nanyang Technological University

Fillers are materials used in composite materials to improve the properties of products. Fillers such as ceramic fillers are often used to improve thermo-mechanical and electrical properties in composite materials for electronic packaging. This project aims to provide a deeper understanding of the materials used as fillers and composites in electronic packaging as well as the on the thermal property, thermal conductivity. The project starts off with literature reviews of current materials researched and used for electronic packaging as well as model predictions for thermal properties such as thermal conductivity. After which, the author used a computer aided design (CAD) programme, Ansys Workbench Material Designer, that ran simulations to calculate the thermal conductivity of Representative Volume Elements (RVEs) of composite materials based on literature reviews. From the results, the author is then able to verify the reliability of the by challenging the model predictions and theories with the difference or coherence of data explained by the author in this report as well. Lastly, this report ends off with intentions for the FYP and future works, suggestions and improvement for the project as well as the future trends for fillers and composite materials in electronic packaging.