Understanding fillers for electronic packaging

• Main Author: Lim, Daniel Kang Xin
• Other Authors: Hortense Le Ferrand
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2021
• Subjects: Engineering::Materials::Composite materials
• Online Access: https://hdl.handle.net/10356/147776
• Institution: Nanyang Technological University

Fillers are materials used in composite materials to improve the properties of products. Fillers such as ceramic fillers are often used to improve thermo-mechanical and electrical properties in composite materials for electronic packaging. This project aims to provide a deeper understanding of the m...