Ceramic-polymer composites for electronic packaging
This project aims to develop a high thermal conductive material capable of being used for electronic packaging to combat the challenges such as overheating in electronic devices resulting from limits of miniaturization and increase in packing density of transistors. The highly isotropic thermal p...
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| Format: | Final Year Project |
| Language: | English |
| Published: |
Nanyang Technological University
2021
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| Online Access: | https://hdl.handle.net/10356/147870 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | This project aims to develop a high thermal conductive material capable of being
used for electronic packaging to combat the challenges such as overheating in
electronic devices resulting from limits of miniaturization and increase in packing
density of transistors. The highly isotropic thermal properties of hexagonal Boron
Nitride (hBN) show a promise as a candidate to pave the way to high performance
and reliable electronics.
In this report, both fabrication and characterization of magnetically aligned
magnetic hexagonal Boron Nitride (mhBN) will be discussed, along with the effects
of sintering at various temperature, and the efforts to infiltrate the samples with an
epoxy polymer matrix. |
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