Ceramic-polymer composites for electronic packaging

• Main Author: Chan, Chin Kiat
• Other Authors: Hortense Le Ferrand
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2021
• Subjects: Engineering::Materials
• Online Access: https://hdl.handle.net/10356/147870
• Institution: Nanyang Technological University

This project aims to develop a high thermal conductive material capable of being used for electronic packaging to combat the challenges such as overheating in electronic devices resulting from limits of miniaturization and increase in packing density of transistors. The highly isotropic thermal p...