Thermomechanical behavior of flexible composite substrate for microelectronic packaging

The warpage of a flexible composite substrate attached to a metal frame carrier during post curing process was assessed by finite element modeling. Both small displacement analysis (SDA) using ANSYS and large displacement analysis (LDA) using ABAQUS software were tried. The flexible substrate was mo...

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Bibliographic Details
Main Authors: Zuñega, Jonee Christine, Paran, Alexander P., Amorsolo, Alberto, Jr.
Format: text
Published: Animo Repository 2003
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Online Access:https://animorepository.dlsu.edu.ph/faculty_research/9442
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Institution: De La Salle University