Thermomechanical behavior of flexible composite substrate for microelectronic packaging

The warpage of a flexible composite substrate attached to a metal frame carrier during post curing process was assessed by finite element modeling. Both small displacement analysis (SDA) using ANSYS and large displacement analysis (LDA) using ABAQUS software were tried. The flexible substrate was mo...

Full description

Saved in:
Bibliographic Details
Main Authors: Zuñega, Jonee Christine, Paran, Alexander P., Amorsolo, Alberto, Jr.
Format: text
Published: Animo Repository 2003
Subjects:
Online Access:https://animorepository.dlsu.edu.ph/faculty_research/9442
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: De La Salle University
id oai:animorepository.dlsu.edu.ph:faculty_research-10812
record_format eprints
spelling oai:animorepository.dlsu.edu.ph:faculty_research-108122023-06-13T02:22:13Z Thermomechanical behavior of flexible composite substrate for microelectronic packaging Zuñega, Jonee Christine Paran, Alexander P. Amorsolo, Alberto, Jr. The warpage of a flexible composite substrate attached to a metal frame carrier during post curing process was assessed by finite element modeling. Both small displacement analysis (SDA) using ANSYS and large displacement analysis (LDA) using ABAQUS software were tried. The flexible substrate was modeled as a composite laminate and stress-strain relations were based on assumption of isotropic, segmentally-heterogeneous property and plane stress condition. Validation of Finite Element Analysis (FEA) results were carried out using Shadow Moire experiments as well as oven curing runs. To investigate effects on the warpage by such substrate-related factors as layer symmetry, use of copper panels and use of frame carrier, a 23 factorial experimental design was utilized to estimate the maximum displacement/thickness response at different combinations of the three factors as predicted by FE-LDA. Results showed that the effects of the three factors are far from additive but rather dictated by major interactions, with the most pronounced interaction involving the layer symmetry and the frame carrier. Results of the validation runs showed that FE-LDA estimates were more realistic than those of FE-SDA since the maximum average displacement/thickness of 60.6 for FE-LDA was between the average for Shadow Moire data (57.5) and oven curing data (72.5) with FE-SDA giving estimates which were unrealistically high (125). The material component of the flexible substrate which contributed the greatest amount of displacement is attributed to the photoresist layer rather than the polyimide and metal layers considering it has the highest coefficient of thermal expansion. 2003-01-01T08:00:00Z text https://animorepository.dlsu.edu.ph/faculty_research/9442 Faculty Research Work Animo Repository Microelectronic packaging—Thermomechanical properties Materials Science and Engineering Mechanical Engineering
institution De La Salle University
building De La Salle University Library
continent Asia
country Philippines
Philippines
content_provider De La Salle University Library
collection DLSU Institutional Repository
topic Microelectronic packaging—Thermomechanical properties
Materials Science and Engineering
Mechanical Engineering
spellingShingle Microelectronic packaging—Thermomechanical properties
Materials Science and Engineering
Mechanical Engineering
Zuñega, Jonee Christine
Paran, Alexander P.
Amorsolo, Alberto, Jr.
Thermomechanical behavior of flexible composite substrate for microelectronic packaging
description The warpage of a flexible composite substrate attached to a metal frame carrier during post curing process was assessed by finite element modeling. Both small displacement analysis (SDA) using ANSYS and large displacement analysis (LDA) using ABAQUS software were tried. The flexible substrate was modeled as a composite laminate and stress-strain relations were based on assumption of isotropic, segmentally-heterogeneous property and plane stress condition. Validation of Finite Element Analysis (FEA) results were carried out using Shadow Moire experiments as well as oven curing runs. To investigate effects on the warpage by such substrate-related factors as layer symmetry, use of copper panels and use of frame carrier, a 23 factorial experimental design was utilized to estimate the maximum displacement/thickness response at different combinations of the three factors as predicted by FE-LDA. Results showed that the effects of the three factors are far from additive but rather dictated by major interactions, with the most pronounced interaction involving the layer symmetry and the frame carrier. Results of the validation runs showed that FE-LDA estimates were more realistic than those of FE-SDA since the maximum average displacement/thickness of 60.6 for FE-LDA was between the average for Shadow Moire data (57.5) and oven curing data (72.5) with FE-SDA giving estimates which were unrealistically high (125). The material component of the flexible substrate which contributed the greatest amount of displacement is attributed to the photoresist layer rather than the polyimide and metal layers considering it has the highest coefficient of thermal expansion.
format text
author Zuñega, Jonee Christine
Paran, Alexander P.
Amorsolo, Alberto, Jr.
author_facet Zuñega, Jonee Christine
Paran, Alexander P.
Amorsolo, Alberto, Jr.
author_sort Zuñega, Jonee Christine
title Thermomechanical behavior of flexible composite substrate for microelectronic packaging
title_short Thermomechanical behavior of flexible composite substrate for microelectronic packaging
title_full Thermomechanical behavior of flexible composite substrate for microelectronic packaging
title_fullStr Thermomechanical behavior of flexible composite substrate for microelectronic packaging
title_full_unstemmed Thermomechanical behavior of flexible composite substrate for microelectronic packaging
title_sort thermomechanical behavior of flexible composite substrate for microelectronic packaging
publisher Animo Repository
publishDate 2003
url https://animorepository.dlsu.edu.ph/faculty_research/9442
_version_ 1769841879361257472