Thermomechanical behavior of flexible composite substrate for microelectronic packaging

• Main Authors: Zuñega, Jonee Christine, Paran, Alexander P., Amorsolo, Alberto, Jr.
• Format: text
• Published: Animo Repository 2003
• Subjects: Microelectronic packaging—Thermomechanical properties; Materials Science and Engineering; Mechanical Engineering
• Online Access: https://animorepository.dlsu.edu.ph/faculty_research/9442
• Institution: De La Salle University

The warpage of a flexible composite substrate attached to a metal frame carrier during post curing process was assessed by finite element modeling. Both small displacement analysis (SDA) using ANSYS and large displacement analysis (LDA) using ABAQUS software were tried. The flexible substrate was mo...