Thermomechanical behavior of flexible composite substrate for microelectronic packaging

• المؤلفون الرئيسيون: Zuñega, Jonee Christine, Paran, Alexander P., Amorsolo, Alberto, Jr.
• التنسيق: text
• منشور في: Animo Repository 2003
• الموضوعات: Microelectronic packaging—Thermomechanical properties; Materials Science and Engineering; Mechanical Engineering
• الوصول للمادة أونلاين: https://animorepository.dlsu.edu.ph/faculty_research/9442

The warpage of a flexible composite substrate attached to a metal frame carrier during post curing process was assessed by finite element modeling. Both small displacement analysis (SDA) using ANSYS and large displacement analysis (LDA) using ABAQUS software were tried. The flexible substrate was mo...