Effect of high temperature aging on the performance of nanoCu sintered joints

Harsh environment electronics need to maintain their functionality while working at conditions such as under high current density, high operating frequency and high working temperature for power electronics devices. To realise the favourable performance of such devices, the package and assembly tech...

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Bibliographic Details
Main Author: Lim, Rachel Ai Ying
Other Authors: Gan Chee Lip
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2021
Subjects:
Online Access:https://hdl.handle.net/10356/147872
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Institution: Nanyang Technological University
Language: English
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