PIC-integrable, uniformly 056%-tensile strained Ge-on-insulator photodiodes enabled by recessed SiNx stressor
Mechanical strain engineering has been promising for many integrated photonic applications. However, for the engineering of material electronic bandgap, a trade-off exists between the strain uniformity and the integration compatibility with photonic-integrated circuits (PICs). Herein, we adopted...
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Main Authors: | , , , , , , , |
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格式: | Article |
語言: | English |
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2021
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在線閱讀: | https://hdl.handle.net/10356/148609 |
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機構: | Nanyang Technological University |
語言: | English |