PIC-integrable, uniformly 056%-tensile strained Ge-on-insulator photodiodes enabled by recessed SiNx stressor

Mechanical strain engineering has been promising for many integrated photonic applications. However, for the engineering of material electronic bandgap, a trade-off exists between the strain uniformity and the integration compatibility with photonic-integrated circuits (PICs). Herein, we adopted...

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Main Authors: Lin, Yiding, Ma, Danhao, Lee, Kwang Hong, Wen, Rui-Tao, Syaranamual, Govindo, Kimerling, Lionel, Tan, Chuan Seng, Michel, Jurgen
其他作者: School of Electrical and Electronic Engineering
格式: Article
語言:English
出版: 2021
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在線閱讀:https://hdl.handle.net/10356/148609
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機構: Nanyang Technological University
語言: English