Development of copper wire laying techniques for 3D printing

General 3D printing technology has been around for decades, but adopting this to print electronic circuits has proven to be challenging. Research in this field is still in its infancy stages, as existing methods of 3D printing in electronic circuits have its respective shortcomings. This makes a sin...

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Main Author: Ng, Nigel Youee
Other Authors: Yeong Wai Yee
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2021
Subjects:
Online Access:https://hdl.handle.net/10356/150848
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1508482021-06-10T00:57:30Z Development of copper wire laying techniques for 3D printing Ng, Nigel Youee Yeong Wai Yee School of Mechanical and Aerospace Engineering WYYeong@ntu.edu.sg Engineering::Mechanical engineering General 3D printing technology has been around for decades, but adopting this to print electronic circuits has proven to be challenging. Research in this field is still in its infancy stages, as existing methods of 3D printing in electronic circuits have its respective shortcomings. This makes a single, practical method of 3D printing electronic circuits difficult to achieve, much less be commercialised and used on a wider scale. This project aims to develop an in-situ copper wire laying technique for a large format hybrid 3D printer. In the literature review section, existing methods of 3D printing electronic circuits will be explored. In order to achieve a successful copper wire laying technique, a hybrid print head with several capabilities of printing copper wires had to be first developed and integrated with an existing printer. The printer specifications, design modifications and detailed tests for printing parameters will be covered. Specifically, tests were conducted to determine the ideal temperature, best anchoring and embedding configuration, as well as tool height offset. Combining these optimal printing parameters to establish a feasible embedding technique, a proof of concept to test the functionality of the circuit will be presented. On top of developing a successful copper wire laying technique, this paper will conclude by discussing the potential applications of such findings on the Direct Digital Manufacturing (DDM) industry and possible improvements for future research. Bachelor of Engineering (Mechanical Engineering) 2021-06-09T11:24:53Z 2021-06-09T11:24:53Z 2021 Final Year Project (FYP) Ng, N. Y. (2021). Development of copper wire laying techniques for 3D printing. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/150848 https://hdl.handle.net/10356/150848 en application/pdf Nanyang Technological University
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering::Mechanical engineering
spellingShingle Engineering::Mechanical engineering
Ng, Nigel Youee
Development of copper wire laying techniques for 3D printing
description General 3D printing technology has been around for decades, but adopting this to print electronic circuits has proven to be challenging. Research in this field is still in its infancy stages, as existing methods of 3D printing in electronic circuits have its respective shortcomings. This makes a single, practical method of 3D printing electronic circuits difficult to achieve, much less be commercialised and used on a wider scale. This project aims to develop an in-situ copper wire laying technique for a large format hybrid 3D printer. In the literature review section, existing methods of 3D printing electronic circuits will be explored. In order to achieve a successful copper wire laying technique, a hybrid print head with several capabilities of printing copper wires had to be first developed and integrated with an existing printer. The printer specifications, design modifications and detailed tests for printing parameters will be covered. Specifically, tests were conducted to determine the ideal temperature, best anchoring and embedding configuration, as well as tool height offset. Combining these optimal printing parameters to establish a feasible embedding technique, a proof of concept to test the functionality of the circuit will be presented. On top of developing a successful copper wire laying technique, this paper will conclude by discussing the potential applications of such findings on the Direct Digital Manufacturing (DDM) industry and possible improvements for future research.
author2 Yeong Wai Yee
author_facet Yeong Wai Yee
Ng, Nigel Youee
format Final Year Project
author Ng, Nigel Youee
author_sort Ng, Nigel Youee
title Development of copper wire laying techniques for 3D printing
title_short Development of copper wire laying techniques for 3D printing
title_full Development of copper wire laying techniques for 3D printing
title_fullStr Development of copper wire laying techniques for 3D printing
title_full_unstemmed Development of copper wire laying techniques for 3D printing
title_sort development of copper wire laying techniques for 3d printing
publisher Nanyang Technological University
publishDate 2021
url https://hdl.handle.net/10356/150848
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