Assembly process and electrical properties of top-transferred graphene on carbon nanotubes for carbon-based 3-D interconnects

Carbon nanomaterials, graphene, and carbon nanotubes (CNTs) have emerged as promising materials for the integration of future advance packaging technologies. The main benefits of carbon nanomaterials include excellent electrical, thermal, and mechanical properties. In this article, the transfer proc...

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Main Authors: Zhu, Ye, Tan, Chong Wei, Chua, Shen Lin, Lim, Yu Dian, Vaisband, Boris, Tay, Beng Kang, Friedman, Eby G., Tan, Chuan Seng
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2021
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Online Access:https://hdl.handle.net/10356/151165
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-1511652021-06-07T01:44:13Z Assembly process and electrical properties of top-transferred graphene on carbon nanotubes for carbon-based 3-D interconnects Zhu, Ye Tan, Chong Wei Chua, Shen Lin Lim, Yu Dian Vaisband, Boris Tay, Beng Kang Friedman, Eby G. Tan, Chuan Seng School of Electrical and Electronic Engineering Engineering::Electrical and electronic engineering Carbon Nanotube Graphene Carbon nanomaterials, graphene, and carbon nanotubes (CNTs) have emerged as promising materials for the integration of future advance packaging technologies. The main benefits of carbon nanomaterials include excellent electrical, thermal, and mechanical properties. In this article, the transfer process of a top graphene layer onto the as-grown CNT bundles was successfully performed with direct graphene-to-CNT contact at the interface. Four-point-probe (4PP) I-V characterization suggests that an ohmic contact was achieved between the graphene and CNTs. Low CNT bump resistance of 2.1 Ω for 90 000-μm 2 CNT area including the CNT-graphene contact resistance was obtained, demonstrating a reduction in the contact resistance between the CNT and Au under the same fabrication and measurement conditions. This work presents the preliminary results for the assembly process of top-transferred graphene on the CNTs and the electrical properties of direct CNT-graphene contact, paving the way for the implementation of full-carbon-based three-dimensional (3-D) interconnects. Ministry of Education (MOE) Accepted version This work was supported by the Ministry of Education (MOE) Tier-2 under Grant #MOE2014-T2-2-105 (ARC22/15). 2021-06-07T01:44:13Z 2021-06-07T01:44:13Z 2019 Journal Article Zhu, Y., Tan, C. W., Chua, S. L., Lim, Y. D., Vaisband, B., Tay, B. K., Friedman, E. G. & Tan, C. S. (2019). Assembly process and electrical properties of top-transferred graphene on carbon nanotubes for carbon-based 3-D interconnects. IEEE Transactions On Components, Packaging and Manufacturing Technology, 10(3), 516-524. https://dx.doi.org/10.1109/TCPMT.2019.2940511 2156-3950 0000-0002-5540-2723 0000-0002-9540-8708 0000-0003-4188-997X 0000-0002-6176-5918 0000-0002-3776-3648 0000-0002-5549-7160 0000-0003-1250-9165 https://hdl.handle.net/10356/151165 10.1109/TCPMT.2019.2940511 2-s2.0-85072523689 3 10 516 524 en MOE2014-T2-2-105 (ARC22/15) IEEE Transactions on Components, Packaging and Manufacturing Technology © 2019 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The published version is available at: https://doi.org/10.1109/TCPMT.2019.2940511. application/pdf
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering::Electrical and electronic engineering
Carbon Nanotube
Graphene
spellingShingle Engineering::Electrical and electronic engineering
Carbon Nanotube
Graphene
Zhu, Ye
Tan, Chong Wei
Chua, Shen Lin
Lim, Yu Dian
Vaisband, Boris
Tay, Beng Kang
Friedman, Eby G.
Tan, Chuan Seng
Assembly process and electrical properties of top-transferred graphene on carbon nanotubes for carbon-based 3-D interconnects
description Carbon nanomaterials, graphene, and carbon nanotubes (CNTs) have emerged as promising materials for the integration of future advance packaging technologies. The main benefits of carbon nanomaterials include excellent electrical, thermal, and mechanical properties. In this article, the transfer process of a top graphene layer onto the as-grown CNT bundles was successfully performed with direct graphene-to-CNT contact at the interface. Four-point-probe (4PP) I-V characterization suggests that an ohmic contact was achieved between the graphene and CNTs. Low CNT bump resistance of 2.1 Ω for 90 000-μm 2 CNT area including the CNT-graphene contact resistance was obtained, demonstrating a reduction in the contact resistance between the CNT and Au under the same fabrication and measurement conditions. This work presents the preliminary results for the assembly process of top-transferred graphene on the CNTs and the electrical properties of direct CNT-graphene contact, paving the way for the implementation of full-carbon-based three-dimensional (3-D) interconnects.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Zhu, Ye
Tan, Chong Wei
Chua, Shen Lin
Lim, Yu Dian
Vaisband, Boris
Tay, Beng Kang
Friedman, Eby G.
Tan, Chuan Seng
format Article
author Zhu, Ye
Tan, Chong Wei
Chua, Shen Lin
Lim, Yu Dian
Vaisband, Boris
Tay, Beng Kang
Friedman, Eby G.
Tan, Chuan Seng
author_sort Zhu, Ye
title Assembly process and electrical properties of top-transferred graphene on carbon nanotubes for carbon-based 3-D interconnects
title_short Assembly process and electrical properties of top-transferred graphene on carbon nanotubes for carbon-based 3-D interconnects
title_full Assembly process and electrical properties of top-transferred graphene on carbon nanotubes for carbon-based 3-D interconnects
title_fullStr Assembly process and electrical properties of top-transferred graphene on carbon nanotubes for carbon-based 3-D interconnects
title_full_unstemmed Assembly process and electrical properties of top-transferred graphene on carbon nanotubes for carbon-based 3-D interconnects
title_sort assembly process and electrical properties of top-transferred graphene on carbon nanotubes for carbon-based 3-d interconnects
publishDate 2021
url https://hdl.handle.net/10356/151165
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