Organic monolayers for room temperarture copper bonding

• Main Author: Foo, Qi Hui.
• Other Authors: Wong Chee Cheong
• Format: Final Year Project
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials
• Online Access: http://hdl.handle.net/10356/15340
• Institution: Nanyang Technological University

Wafer level bonding process is a key fabrication step in many integration systems including microelectromechanical (MEMs) and nanoelectromechanical (NEMs). Often harsh bonding conditions used during process, result in large thermomechanical stresses built-up that leads to undesired degradation in de...