Develop new formulation for high performance soft thermal pad

In the thermal management materials market, there are strong interest and huge demand on thermal pad product, however, the hardness and thermal conductivity of current thermal pad products cannot meet certain requirements for high end electrical devices. In this final year project, we find that the...

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Bibliographic Details
Main Author: Foo, Shi Rui.
Other Authors: Tan Lay Poh
Format: Final Year Project
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/15354
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Institution: Nanyang Technological University
Language: English