Develop new formulation for high performance soft thermal pad

• Main Author: Foo, Shi Rui.
• Other Authors: Tan Lay Poh
• Format: Final Year Project
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Materials::Organic/Polymer electronics
• Online Access: http://hdl.handle.net/10356/15354
• Institution: Nanyang Technological University

In the thermal management materials market, there are strong interest and huge demand on thermal pad product, however, the hardness and thermal conductivity of current thermal pad products cannot meet certain requirements for high end electrical devices. In this final year project, we find that the...