Study of reactive sputtering process in semiconductor manufacturing

• Main Author: Merryanty.
• Other Authors: Li Chuan
• Format: Final Year Project
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Manufacturing
• Online Access: http://hdl.handle.net/10356/15782
• Institution: Nanyang Technological University

Plasma state occurs when energy is added to gas causing it to be ionised and this state is transferred to material surface for subsequent reactions. The surfaces with these ideal properties can then be cleaned, etched or coated and are used for various industrial applications such as automotive engineering, medical technology, household appliances and et cetera. Due to the broad range of potential use of plasma technology which gives high quality results in various products and their functions, understanding the plasma basic is important. In this project, the aim is to study the fundamental principles of plasma and its applications in the reactive sputtering process for micro-opto-electronic devices. The study of plasma fundamental starts from kinetic theory. As this theory describes interaction that is based upon the particles’ phase space distribution, hence brief and general idea of phase space, volume elements, distribution function Boltzmann equation and effects of particles interaction are presented. Following that, there is a brief section on dispersion relation of electron plasma waves for cylindrical coordinates where variation is only in the z-direction, hence one-dimensional system. Plot of relations between frequency and wavelength with varying temperatures and electron number densities is done using MATLAB®. Conclusively, the last section discusses about Molecular Dynamics and Monte Carlo simulations method to calculate and plot the total energy using MATLAB®.