Electrical component classification using 2D and 3D semantic segmentation

Description: The student will focus on 2D/3D semantic segmentation on various semiconductor component, such as TSV, logic bump, memory bump etc. The objective is to detect defects in the buried interconnects inside the chip by detecting and identifying the above structures. It involves 2D/3D data pr...

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Bibliographic Details
Main Author: Zhou, Tongfang
Other Authors: Jiang Xudong
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2022
Subjects:
Online Access:https://hdl.handle.net/10356/158187
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Institution: Nanyang Technological University
Language: English
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