Investigation of greener solvent for electroless nickel plating on ABS substrate

This study uses Cyrene, a bio-friendlier etching solvent than the conventional, more toxic variant, NMP, as an etching solvent for the electroless nickel plating (ENP) process on ABS substrates. The experiments conducted in this study include the solvent etching process, the ENP process using the...

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Main Author: D Selvasegaran, Rasesh
Other Authors: Hirotaka Sato
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2022
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Online Access:https://hdl.handle.net/10356/158820
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spelling sg-ntu-dr.10356-1588202022-06-07T06:03:16Z Investigation of greener solvent for electroless nickel plating on ABS substrate D Selvasegaran, Rasesh Hirotaka Sato School of Mechanical and Aerospace Engineering hirosato@ntu.edu.sg Engineering::Mechanical engineering This study uses Cyrene, a bio-friendlier etching solvent than the conventional, more toxic variant, NMP, as an etching solvent for the electroless nickel plating (ENP) process on ABS substrates. The experiments conducted in this study include the solvent etching process, the ENP process using the PEI conditioner, and the conventional ENP process. The basic design of this study was to compare the ENP characteristics using two sets of samples, one for NMP and one for Cyrene as its etching solvent. The significant factors that were used to analyze the effectiveness of the solvents were the ENP characteristics, conductivity, and peel adhesion test results of the substrate. Using Cyrene and NMP, an indication of the successful etching and nickel plating was done by measuring the resistance of the plated surface using a conductivity probe tester. A simplified Peel Adhesion Tape Test was also used to characterize the peel adhesion strength of the plating on the substrates after the ENP process. Analysis of the results found that Cyrene is a potent substitute for NMP as an etching solvent. Substrates etched with Cyrene performed similarly in plating pattern and area. Cyrene displayed a 12% reduction of the area removed from the Peel Adhesion Test compared to NMP, thus concluding that Cyrene is an excellent bio-friendlier substitute to NMP as an etching solvent. Bachelor of Engineering (Mechanical Engineering) 2022-06-07T06:03:16Z 2022-06-07T06:03:16Z 2022 Final Year Project (FYP) D Selvasegaran, R. (2022). Investigation of greener solvent for electroless nickel plating on ABS substrate. Final Year Project (FYP), Nanyang Technological University, Singapore. https://hdl.handle.net/10356/158820 https://hdl.handle.net/10356/158820 en B398 application/pdf Nanyang Technological University
institution Nanyang Technological University
building NTU Library
continent Asia
country Singapore
Singapore
content_provider NTU Library
collection DR-NTU
language English
topic Engineering::Mechanical engineering
spellingShingle Engineering::Mechanical engineering
D Selvasegaran, Rasesh
Investigation of greener solvent for electroless nickel plating on ABS substrate
description This study uses Cyrene, a bio-friendlier etching solvent than the conventional, more toxic variant, NMP, as an etching solvent for the electroless nickel plating (ENP) process on ABS substrates. The experiments conducted in this study include the solvent etching process, the ENP process using the PEI conditioner, and the conventional ENP process. The basic design of this study was to compare the ENP characteristics using two sets of samples, one for NMP and one for Cyrene as its etching solvent. The significant factors that were used to analyze the effectiveness of the solvents were the ENP characteristics, conductivity, and peel adhesion test results of the substrate. Using Cyrene and NMP, an indication of the successful etching and nickel plating was done by measuring the resistance of the plated surface using a conductivity probe tester. A simplified Peel Adhesion Tape Test was also used to characterize the peel adhesion strength of the plating on the substrates after the ENP process. Analysis of the results found that Cyrene is a potent substitute for NMP as an etching solvent. Substrates etched with Cyrene performed similarly in plating pattern and area. Cyrene displayed a 12% reduction of the area removed from the Peel Adhesion Test compared to NMP, thus concluding that Cyrene is an excellent bio-friendlier substitute to NMP as an etching solvent.
author2 Hirotaka Sato
author_facet Hirotaka Sato
D Selvasegaran, Rasesh
format Final Year Project
author D Selvasegaran, Rasesh
author_sort D Selvasegaran, Rasesh
title Investigation of greener solvent for electroless nickel plating on ABS substrate
title_short Investigation of greener solvent for electroless nickel plating on ABS substrate
title_full Investigation of greener solvent for electroless nickel plating on ABS substrate
title_fullStr Investigation of greener solvent for electroless nickel plating on ABS substrate
title_full_unstemmed Investigation of greener solvent for electroless nickel plating on ABS substrate
title_sort investigation of greener solvent for electroless nickel plating on abs substrate
publisher Nanyang Technological University
publishDate 2022
url https://hdl.handle.net/10356/158820
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