Fine pitch electroless nickel plating

Electroless nickel (EN) plating is a viable interconnection material for flip chip applications due to its process simplicity and low cost. The selective nature of EN plating allows the possibility of a maskless, waferscale process for the fabrication of fine pitch interconnects and this makes it on...

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Bibliographic Details
Main Author: Zee, Bernice Mei Lin
Other Authors: Chen Zhong
Format: Theses and Dissertations
Language:English
Published: 2009
Subjects:
Online Access:http://hdl.handle.net/10356/19333
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Institution: Nanyang Technological University
Language: English