Fine pitch electroless nickel plating
Electroless nickel (EN) plating is a viable interconnection material for flip chip applications due to its process simplicity and low cost. The selective nature of EN plating allows the possibility of a maskless, waferscale process for the fabrication of fine pitch interconnects and this makes it on...
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| Format: | Theses and Dissertations |
| Language: | English |
| Published: |
2009
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| Online Access: | http://hdl.handle.net/10356/19333 |
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| Institution: | Nanyang Technological University |
| Language: | English |
| Summary: | Electroless nickel (EN) plating is a viable interconnection material for flip chip applications due to its process simplicity and low cost. The selective nature of EN plating allows the possibility of a maskless, waferscale process for the fabrication of fine pitch interconnects and this makes it one of the most promising techniques for fine pitch applications. |
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