Fine pitch electroless nickel plating
Electroless nickel (EN) plating is a viable interconnection material for flip chip applications due to its process simplicity and low cost. The selective nature of EN plating allows the possibility of a maskless, waferscale process for the fabrication of fine pitch interconnects and this makes it on...
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sg-ntu-dr.10356-193332023-03-04T16:32:00Z Fine pitch electroless nickel plating Zee, Bernice Mei Lin Chen Zhong School of Materials Science & Engineering DRNTU::Engineering::Materials Electroless nickel (EN) plating is a viable interconnection material for flip chip applications due to its process simplicity and low cost. The selective nature of EN plating allows the possibility of a maskless, waferscale process for the fabrication of fine pitch interconnects and this makes it one of the most promising techniques for fine pitch applications. Master of Engineering (MSE) 2009-12-08T06:30:09Z 2009-12-08T06:30:09Z 2004 2004 Thesis http://hdl.handle.net/10356/19333 en 124 p. application/pdf |
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DRNTU::Engineering::Materials Zee, Bernice Mei Lin Fine pitch electroless nickel plating |
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Electroless nickel (EN) plating is a viable interconnection material for flip chip applications due to its process simplicity and low cost. The selective nature of EN plating allows the possibility of a maskless, waferscale process for the fabrication of fine pitch interconnects and this makes it one of the most promising techniques for fine pitch applications. |
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Chen Zhong |
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Chen Zhong Zee, Bernice Mei Lin |
format |
Theses and Dissertations |
author |
Zee, Bernice Mei Lin |
author_sort |
Zee, Bernice Mei Lin |
title |
Fine pitch electroless nickel plating |
title_short |
Fine pitch electroless nickel plating |
title_full |
Fine pitch electroless nickel plating |
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Fine pitch electroless nickel plating |
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Fine pitch electroless nickel plating |
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fine pitch electroless nickel plating |
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2009 |
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http://hdl.handle.net/10356/19333 |
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