Fine pitch electroless nickel plating

• Main Author: Zee, Bernice Mei Lin
• Other Authors: Chen Zhong
• Format: Theses and Dissertations
• Language: English
• Published: 2009
• Subjects: DRNTU::Engineering::Materials
• Online Access: http://hdl.handle.net/10356/19333
• Institution: Nanyang Technological University

Electroless nickel (EN) plating is a viable interconnection material for flip chip applications due to its process simplicity and low cost. The selective nature of EN plating allows the possibility of a maskless, waferscale process for the fabrication of fine pitch interconnects and this makes it on...