Non-destructive evaluation and defect detection studies on silicon wafer samples using laser shearography

The aim of this project is to use a non-destructive testing method, laser shearography, to examine defects in silicon wafers and composites. Soon after manufacturing, in the testing and inspection phase, parts are examined for defects. Non-destructive Testing (NDT) is used for examining, and tes...

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Bibliographic Details
Main Author: Chugani, Hitesh Harish
Other Authors: Murukeshan Vadakke Matham
Format: Final Year Project
Language:English
Published: Nanyang Technological University 2022
Subjects:
Online Access:https://hdl.handle.net/10356/159064
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Institution: Nanyang Technological University
Language: English