Non-destructive evaluation and defect detection studies on silicon wafer samples using laser shearography

• Main Author: Chugani, Hitesh Harish
• Other Authors: Murukeshan Vadakke Matham
• Format: Final Year Project
• Language: English
• Published: Nanyang Technological University 2022
• Subjects: Engineering::Mechanical engineering
• Online Access: https://hdl.handle.net/10356/159064
• Institution: Nanyang Technological University

The aim of this project is to use a non-destructive testing method, laser shearography, to examine defects in silicon wafers and composites. Soon after manufacturing, in the testing and inspection phase, parts are examined for defects. Non-destructive Testing (NDT) is used for examining, and tes...