Enhancement of convective heat transfer using magnetically flapping fin array

Electronic devices with high power density require efficient and compact heat transfer management methods. While passive fins have been routinely used for heat dissipation, they usually have a limited range of operating conditions in electronic applications. In this study, we explore experimentally...

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Bibliographic Details
Main Authors: Nguyen, Thien-Binh, Liu, Dongdong, Raut, Harshal, Bhattacharya, Amitabh, Sharma, Atul, Tran, Tuan
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2022
Subjects:
Online Access:https://hdl.handle.net/10356/160479
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Institution: Nanyang Technological University
Language: English