Enhancement of convective heat transfer using magnetically flapping fin array
Electronic devices with high power density require efficient and compact heat transfer management methods. While passive fins have been routinely used for heat dissipation, they usually have a limited range of operating conditions in electronic applications. In this study, we explore experimentally...
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Main Authors: | Nguyen, Thien-Binh, Liu, Dongdong, Raut, Harshal, Bhattacharya, Amitabh, Sharma, Atul, Tran, Tuan |
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Other Authors: | School of Mechanical and Aerospace Engineering |
Format: | Article |
Language: | English |
Published: |
2022
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/160479 |
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Institution: | Nanyang Technological University |
Language: | English |
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