Enhancement of convective heat transfer using magnetically flapping fin array

• Main Authors: Nguyen, Thien-Binh, Liu, Dongdong, Raut, Harshal, Bhattacharya, Amitabh, Sharma, Atul, Tran, Tuan
• 其他作者: School of Mechanical and Aerospace Engineering
• 格式: Article
• 語言: English
• 出版: 2022
• 主題: Engineering::Mechanical engineering::Fluid mechanics; Magnetically Actuated Fins; Liquid Cooling
• 在線閱讀: https://hdl.handle.net/10356/160479
• 機構: Nanyang Technological University

Electronic devices with high power density require efficient and compact heat transfer management methods. While passive fins have been routinely used for heat dissipation, they usually have a limited range of operating conditions in electronic applications. In this study, we explore experimentally...