Enhancement of convective heat transfer using magnetically flapping fin array

• المؤلفون الرئيسيون: Nguyen, Thien-Binh, Liu, Dongdong, Raut, Harshal, Bhattacharya, Amitabh, Sharma, Atul, Tran, Tuan
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2022
• الموضوعات: Engineering::Mechanical engineering::Fluid mechanics; Magnetically Actuated Fins; Liquid Cooling
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/160479

Electronic devices with high power density require efficient and compact heat transfer management methods. While passive fins have been routinely used for heat dissipation, they usually have a limited range of operating conditions in electronic applications. In this study, we explore experimentally...