A review of two-phase submerged boiling in thermal management of electronic cooling

• المؤلفون الرئيسيون: Fan, Simiao, Duan, Fei
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2022
• الموضوعات: Engineering::Mechanical engineering; Electronic Cooling; Pool Boiling
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/161214

The increasing cooling demands of electronics have attracted more attention recently for heat removal at the component with higher heat flux and heat density. Boiling, as a two-phase cooling method, is able to achieve a rapid heat removal capacity by utilizing the latent heat from liquid to vapor ph...