A review of two-phase submerged boiling in thermal management of electronic cooling
The increasing cooling demands of electronics have attracted more attention recently for heat removal at the component with higher heat flux and heat density. Boiling, as a two-phase cooling method, is able to achieve a rapid heat removal capacity by utilizing the latent heat from liquid to vapor ph...
Saved in:
Main Authors: | Fan, Simiao, Duan, Fei |
---|---|
Other Authors: | School of Mechanical and Aerospace Engineering |
Format: | Article |
Language: | English |
Published: |
2022
|
Subjects: | |
Online Access: | https://hdl.handle.net/10356/161214 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | Nanyang Technological University |
Language: | English |
Similar Items
-
A Thermally Driven Two-Phase Cooling Device for CPU Cooling
by: CHAN MARK AARON CHAN
Published: (2010) -
Pool boiling heat transfer of saturated water on rough surfaces with the effect of roughening techniques
by: Fan, Simiao, et al.
Published: (2021) -
New pool boiling data for water with copper-foam metal at sub-atmospheric pressures: Experiments and correlation
by: Choon, N.K., et al.
Published: (2014) -
A critical review of pool and flow boiling heat transfer of dielectric fluids on enhanced surfaces
by: Leong, Kai Choong, et al.
Published: (2020) -
A correlation for confined nucleate boiling heat transfer
by: Chan, M.A., et al.
Published: (2014)