Cooling of electronic components with free jet impingement boiling

Cooling of electronic components with free jet impingement boiling

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

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Bibliographic Details
Main Authors: Tay, A.A.O., Xue, H., Yang, C.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Boiling
Jet impingement
Temperature pattern
Thermal test die
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73284
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/73284

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