Cooling of electronic components with free jet impingement boiling

• Main Authors: Tay, A.A.O., Xue, H., Yang, C.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Boiling; Jet impingement; Temperature pattern; Thermal test die
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73284
• Institution: National University of Singapore

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference