Cooling of electronic components with free jet impingement boiling

Cooling of electronic components with free jet impingement boiling

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

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Bibliographic Details
Main Authors: Tay, A.A.O., Xue, H., Yang, C.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Boiling
Jet impingement
Temperature pattern
Thermal test die
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73284
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Institution: National University of Singapore
id sg-nus-scholar.10635-73284
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spelling sg-nus-scholar.10635-732842015-01-29T11:32:41Z Cooling of electronic components with free jet impingement boiling Tay, A.A.O. Xue, H. Yang, C. MECHANICAL ENGINEERING Boiling Jet impingement Temperature pattern Thermal test die Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 387-394 PITEF 2014-06-19T05:33:17Z 2014-06-19T05:33:17Z 2002 Conference Paper Tay, A.A.O.,Xue, H.,Yang, C. (2002). Cooling of electronic components with free jet impingement boiling. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference : 387-394. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/73284 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
topic Boiling
Jet impingement
Temperature pattern
Thermal test die
spellingShingle Boiling
Jet impingement
Temperature pattern
Thermal test die
Tay, A.A.O.
Xue, H.
Yang, C.
Cooling of electronic components with free jet impingement boiling
description Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Tay, A.A.O.
Xue, H.
Yang, C.
format Conference or Workshop Item
author Tay, A.A.O.
Xue, H.
Yang, C.
author_sort Tay, A.A.O.
title Cooling of electronic components with free jet impingement boiling
title_short Cooling of electronic components with free jet impingement boiling
title_full Cooling of electronic components with free jet impingement boiling
title_fullStr Cooling of electronic components with free jet impingement boiling
title_full_unstemmed Cooling of electronic components with free jet impingement boiling
title_sort cooling of electronic components with free jet impingement boiling
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73284
_version_ 1681087720087093248

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