A review of two-phase submerged boiling in thermal management of electronic cooling
The increasing cooling demands of electronics have attracted more attention recently for heat removal at the component with higher heat flux and heat density. Boiling, as a two-phase cooling method, is able to achieve a rapid heat removal capacity by utilizing the latent heat from liquid to vapor ph...
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| Main Authors: | , |
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| 格式: | Article |
| 語言: | English |
| 出版: |
2022
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| 在線閱讀: | https://hdl.handle.net/10356/161214 |
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| 機構: | Nanyang Technological University |
| 語言: | English |