Advanced polishing, grinding and finishing processes for various manufacturing applications: a review

• المؤلف الرئيسي: Zhong, Zhao Wei
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2022
• الموضوعات: Engineering::Mechanical engineering; Polishing; Grinding
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/161725
• المؤسسة: Nanyang Technological University

This article reviews advanced polishing, grinding and finishing processes for challenging manufacturing applications. The topics covered are machining of advanced alloys; machining of wafers; strengths of dies after machining; grinding and polishing for wafer level packages; hybrid finishing process...