Advanced polishing, grinding and finishing processes for various manufacturing applications: a review
This article reviews advanced polishing, grinding and finishing processes for challenging manufacturing applications. The topics covered are machining of advanced alloys; machining of wafers; strengths of dies after machining; grinding and polishing for wafer level packages; hybrid finishing process...
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| Format: | Article |
| Language: | English |
| Published: |
2022
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/161725 |
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| Institution: | Nanyang Technological University |
| Language: | English |