Advanced polishing, grinding and finishing processes for various manufacturing applications: a review

Advanced polishing, grinding and finishing processes for various manufacturing applications: a review

This article reviews advanced polishing, grinding and finishing processes for challenging manufacturing applications. The topics covered are machining of advanced alloys; machining of wafers; strengths of dies after machining; grinding and polishing for wafer level packages; hybrid finishing process...

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書目詳細資料
主要作者:	Zhong, Zhao Wei
其他作者:	School of Mechanical and Aerospace Engineering
格式:	Article
語言:	English
出版:	2022
主題:	Engineering::Mechanical engineering Polishing Grinding
在線閱讀:	https://hdl.handle.net/10356/161725
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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