Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing

Slurry plays an important role in the material removal of chemical mechanical polishing (CMP). However, the behavior of abrasive particles of the slurry in the interface between the wafer and the pad during CMP is not fully understood. In this paper, a new computational fluid dynamic (CFD) model was...

Full description

Saved in:
Bibliographic Details
Main Authors: Nguyen, N. Y., Tian, Yebing, Zhong, Zhao Wei
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2016
Subjects:
Online Access:https://hdl.handle.net/10356/85031
http://hdl.handle.net/10220/40943
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Nanyang Technological University
Language: English