An analytical investigation of pad wear caused by the conditioner in fixed abrasive chemical–mechanical polishing

Fixed abrasive chemical–mechanical polishing (CMP) is an efficient surface finishing method. The non-uniformity of substrates after polishing is one of the most interesting things in current trends in research. One of the reasons for the non-uniformity is pad wear. The pad in this polishing process...

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Main Authors: Nguyen, N. Y., Zhong, Zhao Wei, Tian, Yebing
其他作者: School of Mechanical and Aerospace Engineering
格式: Article
語言:English
出版: 2016
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在線閱讀:https://hdl.handle.net/10356/85041
http://hdl.handle.net/10220/40933
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機構: Nanyang Technological University
語言: English