An analytical investigation of pad wear caused by the conditioner in fixed abrasive chemical–mechanical polishing
Fixed abrasive chemical–mechanical polishing (CMP) is an efficient surface finishing method. The non-uniformity of substrates after polishing is one of the most interesting things in current trends in research. One of the reasons for the non-uniformity is pad wear. The pad in this polishing process...
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Main Authors: | , , |
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格式: | Article |
語言: | English |
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2016
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在線閱讀: | https://hdl.handle.net/10356/85041 http://hdl.handle.net/10220/40933 |
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機構: | Nanyang Technological University |
語言: | English |