Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad
10.1016/j.jmatprotec.2013.09.010
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| Main Authors: | , , , , , |
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| 格式: | Article |
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2014
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| 在線閱讀: | http://scholarbank.nus.edu.sg/handle/10635/60780 |
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| 機構: | National University of Singapore |