Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad

Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad

10.1016/j.jmatprotec.2013.09.010

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Bibliographic Details
Main Authors: Fan, C., Zhao, J., Zhang, L., Wong, Y.S., Hong, G.S., Zhou, W.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Free abrasive polishing
Material removal index
Material removal profile
Sub-aperture pad
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60780
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-607802023-10-30T20:55:34Z Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad Fan, C. Zhao, J. Zhang, L. Wong, Y.S. Hong, G.S. Zhou, W. MECHANICAL ENGINEERING Free abrasive polishing Material removal index Material removal profile Sub-aperture pad 10.1016/j.jmatprotec.2013.09.010 Journal of Materials Processing Technology 214 2 285-294 JMPTE 2014-06-17T06:27:15Z 2014-06-17T06:27:15Z 2014 Article Fan, C., Zhao, J., Zhang, L., Wong, Y.S., Hong, G.S., Zhou, W. (2014). Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad. Journal of Materials Processing Technology 214 (2) : 285-294. ScholarBank@NUS Repository. https://doi.org/10.1016/j.jmatprotec.2013.09.010 09240136 http://scholarbank.nus.edu.sg/handle/10635/60780 000329560400015 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Free abrasive polishing
Material removal index
Material removal profile
Sub-aperture pad
spellingShingle Free abrasive polishing
Material removal index
Material removal profile
Sub-aperture pad
Fan, C.
Zhao, J.
Zhang, L.
Wong, Y.S.
Hong, G.S.
Zhou, W.
Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad
description 10.1016/j.jmatprotec.2013.09.010
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Fan, C.
Zhao, J.
Zhang, L.
Wong, Y.S.
Hong, G.S.
Zhou, W.
format Article
author Fan, C.
Zhao, J.
Zhang, L.
Wong, Y.S.
Hong, G.S.
Zhou, W.
author_sort Fan, C.
title Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad
title_short Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad
title_full Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad
title_fullStr Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad
title_full_unstemmed Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad
title_sort modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/60780
_version_ 1781781913670778880

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