Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad

10.1016/j.jmatprotec.2013.09.010

Saved in:
Bibliographic Details
Main Authors: Fan, C., Zhao, J., Zhang, L., Wong, Y.S., Hong, G.S., Zhou, W.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/60780
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Similar Items