Modeling and analysis of the material removal profile for free abrasive polishing with sub-aperture pad
10.1016/j.jmatprotec.2013.09.010
Saved in:
Main Authors: | Fan, C., Zhao, J., Zhang, L., Wong, Y.S., Hong, G.S., Zhou, W. |
---|---|
Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
|
Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/60780 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Effects of chemical slurries on fixed abrasive chemical-mechanical polishing of optical silicon substrates
by: Tian, Yebing, et al.
Published: (2016) -
An analytical investigation of pad wear caused by the conditioner in fixed abrasive chemical–mechanical polishing
by: Nguyen, N. Y., et al.
Published: (2016) -
Development of fixed abrasive chemical mechanical polishing process for glass disk substrates
by: Tian, Ye Bing, et al.
Published: (2016) -
CHEMICAL MECHANICAL POLISHING PAD PROFILE OPTIMIZATION
by: KEN LI FUNG YUEN
Published: (2019) -
Material removal analysis for compliant polishing tool using adaptive meshing technique and Archard wear model
by: Arunachalam, Adhithya Plato Sidharth, et al.
Published: (2020)