An analytical investigation of pad wear caused by the conditioner in fixed abrasive chemical–mechanical polishing

• Main Authors: Nguyen, N. Y., Zhong, Zhao Wei, Tian, Yebing
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2016
• Subjects: Chemical–mechanical polishing; Fixed abrasive
• Online Access: https://hdl.handle.net/10356/85041; http://hdl.handle.net/10220/40933
• Institution: Nanyang Technological University

Fixed abrasive chemical–mechanical polishing (CMP) is an efficient surface finishing method. The non-uniformity of substrates after polishing is one of the most interesting things in current trends in research. One of the reasons for the non-uniformity is pad wear. The pad in this polishing process...