Recent developments and applications of chemical mechanical polishing

This article discusses advanced developments and applications of chemical mechanical polishing (CMP) published recently in the selected papers indexed by Web of Science. The topics covered are advances in slurry and abrasives, pads and conditioning, CMP for semiconductor device manufacturing, CMP fo...

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Bibliographic Details
Main Author: Zhong, Zhao Wei
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2022
Subjects:
Online Access:https://hdl.handle.net/10356/155150
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Institution: Nanyang Technological University
Language: English