Recent developments and applications of chemical mechanical polishing

• Main Author: Zhong, Zhao Wei
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2022
• Subjects: Engineering::Mechanical engineering; Slurry; Abrasive
• Online Access: https://hdl.handle.net/10356/155150
• Institution: Nanyang Technological University

This article discusses advanced developments and applications of chemical mechanical polishing (CMP) published recently in the selected papers indexed by Web of Science. The topics covered are advances in slurry and abrasives, pads and conditioning, CMP for semiconductor device manufacturing, CMP fo...