Characterization of copper chemical mechanical polishing induced defects
Our results show that defects such as scratches and organic residues were produced by our Cu CMP process. Scratches can be attributed to the abrasive particles incorporated in the polishing slurry.
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| 格式: | Theses and Dissertations |
| 出版: |
2008
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| 主題: | |
| 在線閱讀: | http://hdl.handle.net/10356/3564 |
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| 機構: | Nanyang Technological University |